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Optical Inspection of Microsystems - - Bog - Taylor & Francis Ltd - Plusbog.dk

Optical Inspection of Microsystems - - Bog - Taylor & Francis Ltd - Plusbog.dk

Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts. Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.

DKK 468.00
1

More-than-Moore Devices and Integration for Semiconductors - - Bog - Springer International Publishing AG - Plusbog.dk

Conceptual and Methodological Approaches to Navigating Immigrant Ecologies - - Bog - Springer Nature Switzerland AG - Plusbog.dk

Conceptual and Methodological Approaches to Navigating Immigrant Ecologies - - Bog - Springer Nature Switzerland AG - Plusbog.dk

Modern Optics and Photonics of Nano- and Microsystems - Yu. N. Kulchin - Bog - Taylor & Francis Ltd - Plusbog.dk

Microbiochips Monolithically Integrated with Microfluidics, Micromechanics, Photonics & Electronics by 3D Femtosecond Laser Direct Writing - Katsumi

Introduction to Microsystem Packaging Technology - Jing Chen - Bog - Taylor & Francis Ltd - Plusbog.dk

Introduction to Microsystem Packaging Technology - Jing Chen - Bog - Taylor & Francis Ltd - Plusbog.dk

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

DKK 634.00
1

Meaningful Healthcare Experience Design - Scott Goodwin - Bog - Taylor & Francis Ltd - Plusbog.dk

Meaningful Healthcare Experience Design - Scott Goodwin - Bog - Taylor & Francis Inc - Plusbog.dk

Psychological Perspectives on Understanding and Addressing Violence Against Children - - Bog - Oxford University Press Inc - Plusbog.dk

Religious Diversity in Canadian Public Schools - Dia Dabby - Bog - University of British Columbia Press - Plusbog.dk

Virtual Teams - Jeffrey Stamps - Bog - John Wiley & Sons Inc - Plusbog.dk

Sensors and Measurement Systems - Walter (university Of Bremen Lang - Bog - River Publishers - Plusbog.dk

Learner-Centered Design - Wayne Reeves - Bog - SAGE Publications Inc - Plusbog.dk

Sensors and Measurement Systems - Walter Lang - Bog - River Publishers - Plusbog.dk

Practical MEMS - Ville Kaajakari - Bog - Small Gear Publishing - Plusbog.dk

Customer Relationship Management - Lynette Ryals - Bog - Taylor & Francis Ltd - Plusbog.dk

Introduction to Microfluidics - Patrick Tabeling - Bog - Oxford University Press - Plusbog.dk

Instructional Risk in Education - Stuart (university Of Auckland Mcnaughton - Bog - Taylor & Francis Inc - Plusbog.dk

Instructional Risk in Education - Stuart (university Of Auckland Mcnaughton - Bog - Taylor & Francis Inc - Plusbog.dk

This book is based on the idea that instruction carries in-built risks, and instructional practices can be counterproductive unless used with care. Referencing a wide range of approaches to increasing effectiveness, Instructional Risk provides an explanation of why some forms of instruction are less powerful than they should be. Elaborating on rather than advising against these forms of instruction, it illustrates how teachers can use instructional practices effectively through managing risk and being adaptive in their use of them in the many and dynamic microsystems of the classroom. The book is unique in bringing together disparate evidence from a range of research areas and across core curriculum areas of English Language Arts, mathematics and science, for a theory of ‘Instructional Risk’; the basic proposition for which is that instructional approaches carry known and predictable risks. The book focuses on the expertise required to overcome risks, which are exaggerated for children from communities not well served by our schools. The book is also a critique of research that is ''programmatic'' and limited to experimental evidence and summaries of that evidence which are uncritically developed into statements about ‘What Works’. Made to be both an explication of the theory through repeated examples as well as a technical resource, this book will be vital reading for lecturers and postgraduate students of Education and Educational Psychology.

DKK 403.00
1

Foundations of 3D Graphics Programming - Chunyang Chen - Bog - Springer London Ltd - Plusbog.dk

Foundations of 3D Graphics Programming - Chunyang Chen - Bog - Springer London Ltd - Plusbog.dk

OpenGL, which has been bound in C, is a seasoned graphics library for scientists and engineers. As we know, Java is a rapidly growing language becoming the de facto standard of Computer Science learning and application development platform as many undergraduate computer science programs are adopting Java in place of C/C++. Released by Sun Microsystems in June 2003, the recent OpenGL binding with Java, JOGL, provides students, scientists, and engineers a new venue of graphics learning, research, and applications. Overview This book aims to be a shortcut to graphics theory and programming in JOGL. Specifically, it covers OpenGL programming in Java, using JOGL, along with concise computer graphics theories. It covers all graphics basics and several advanced topics without including some implementation details that are not necessary in graphics applications. It also covers some basic concepts in Java programming for C/C++ programmers. It is designed as a textbook for students who know programming basics already. It is an excellent shortcut to learn 3D graphics for scientists and engineers who understand Java programming. It is also a good reference for C/C++ graphics vi Preface programmers to learn Java and JOGL. This book is a companion to Guide to Graphics Software Tools (Springer-Verlag, New York, ISBN 0-387-95049-4), which covers a smaller graphics area with similar examples in C but has a comprehensive list of graphics software tools. Organization and Features This book concisely introduces graphics theory and programming in Java with JOGL.

DKK 498.00
1

Corporate Financial Analysis with Microsoft Excel - Francis Clauss - Bog - McGraw-Hill Education - Europe - Plusbog.dk

Corporate Financial Analysis with Microsoft Excel - Francis Clauss - Bog - McGraw-Hill Education - Europe - Plusbog.dk

Corporate Financial Analysis with Microsoft ® Excel ® visualizes spreadsheets as an effectivemanagement tool both for financial analysisand for coordinating its results and actionswith marketing, sales, production and serviceoperations, quality control, and other businessfunctions. Taking an integrative view that promotesteamwork across corporate functions andresponsibilities, the book contains dozens ofcharts, diagrams, and actual Excel® screenshotsto reinforce the practical applications ofevery topic it covers. The first two sections—Financial Statements and Cash Budgeting—explain how to use spreadsheets for: - - Preparing income statements,balance sheets, and cashflow statements - - Performing vertical andhorizontal analyses offinancial statements - - Determining financial ratiosand analyzing their trendsand significance - - Combining quantitative andjudgmental techniques to improveforecasts of sales revenues andcustomer demands - - Calculating and applying thetime value of money - - Managing inventories,safety stocks, and theallocation of resources The third and final section—Capital Budgeting—covers capital structure, the cost ofcapital, and leverage; the basics of capitalbudgeting, including taxes and depreciation;applications, such as new facilities, equipmentreplacement, process improvement, leasingversus buying, and nonresidential real estate;and risk analysis of capital budgets and thepotential impacts of unforeseen events. Corporate Financial Analysis with Microsoft ® Excel ® takes a broad view of financial functionsand responsibilities in relation to thoseof other functional parts of modern corporations,and it demonstrates how to use spreadsheetsto integrate and coordinate them. Itprovides many insightful examples and casestudies of real corporations, including Wal-Mart, Sun Microsystems, Nike, H. J. Heinz,Dell, Microsoft, Apple Computer, and IBM. Corporate Financial Analysis with Microsoft ® Excel ® is the ideal tool for managing yourfirm’s short-term operations and long-termcapital investments.

DKK 640.00
1

Design of 3D Integrated Circuits and Systems - - Bog - Taylor & Francis Ltd - Plusbog.dk

Design of 3D Integrated Circuits and Systems - - Bog - Taylor & Francis Ltd - Plusbog.dk

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: - Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer - Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) - Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) - Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications - Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

DKK 684.00
1

The Impact of New Fertility Policies on Early Education and Development in China - - Bog - Taylor & Francis Ltd - Plusbog.dk

The Impact of New Fertility Policies on Early Education and Development in China - - Bog - Taylor & Francis Ltd - Plusbog.dk

This book is among the first to comprehensively examine the far-reaching impact of China’s new fertility policies on early education and development. Since the beginning of the 21st century, China has entered a period of declining fertility rate and aging population, which poses a serious threat to its sustainable development. To address this crisis, China has radically revised its fertility policy through the state’s guidance for regulating couples’ reproductive choices, abandoning its iconic one-child policy, and adopting the selective two-child (2013), universal two-child (2016), and then the three-child (2021) policy. Drawing on empirical evidence obtained through various research methods, this book offers multidisciplinary perspectives on the far-reaching impact of these policies. Part I summarizes the lessons learned from new fertility policies and identifies important directions for future research. Focusing on two major microsystems, part II presents research assessing families’ fertility desire for an additional child and projecting the demand for preschool education. Part III attends to family dynamics and their relation to early learning and development for both only and non-only children. Part IV addresses the importance of expanding access to affordable and high-quality early childhood education and care for children from birth through age 6. The Impact of New Fertility Policies on Early Education and Development in China contributes to policy development and practical improvement and serves as a catalyst to stimulate future studies on the topic. It will be a valuable resource for researchers, policymakers, and practitioners of early childhood education and care, as well as for families of young children. The chapters in this book were originally published as a special issue of Early Education and Development .

DKK 499.00
1

High Performance Computing for Big Data - - Bog - Taylor & Francis Ltd - Plusbog.dk

High Performance Computing for Big Data - - Bog - Taylor & Francis Ltd - Plusbog.dk

High-Performance Computing for Big Data: Methodologies and Applications explores emerging high-performance architectures for data-intensive applications, novel efficient analytical strategies to boost data processing, and cutting-edge applications in diverse fields, such as machine learning, life science, neural networks, and neuromorphic engineering. The book is organized into two main sections. The first section covers Big Data architectures, including cloud computing systems, and heterogeneous accelerators. It also covers emerging 3D IC design principles for memory architectures and devices. The second section of the book illustrates emerging and practical applications of Big Data across several domains, including bioinformatics, deep learning, and neuromorphic engineering. Features Covers a wide range of Big Data architectures, including distributed systems like Hadoop/Spark Includes accelerator-based approaches for big data applications such as GPU-based acceleration techniques, and hardware acceleration such as FPGA/CGRA/ASICs Presents emerging memory architectures and devices such as NVM, STT- RAM, 3D IC design principles Describes advanced algorithms for different big data application domains - Illustrates novel analytics techniques for Big Data applications, scheduling, mapping, and partitioning methodologies Featuring contributions from leading experts, this book presents state-of-the-art research on the methodologies and applications of high-performance computing for big data applications. About the Editor Dr. Chao Wang is an Associate Professor in the School of Computer Science at the University of Science and Technology of China. He is the Associate Editor of ACM Transactions on Design Automations for Electronics Systems (TODAES), Applied Soft Computing, Microprocessors and Microsystems, IET Computers & Digital Techniques, and International Journal of Electronics. Dr. Chao Wang was the recipient of Youth Innovation Promotion Association, CAS, ACM China Rising Star Honorable Mention (2016), and best IP nomination of DATE 2015. He is now on the CCF Technical Committee on Computer Architecture, CCF Task Force on Formal Methods. He is a Senior Member of IEEE, Senior Member of CCF, and a Senior Member of ACM.

DKK 468.00
1