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E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 30.4mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-324-S001-95

GBP 16.76

1

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 35.5mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-628-S001-95

GBP 0.57

1

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 25.3mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-320-S001-95

GBP 0.95

1

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 17.7mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-314-S001-95

GBP 0.67

1

E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 7.6mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-306-S001-95

GBP 0.29

1

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 10.1mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-308-S001-95

GBP 0.34

1

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Wire Wrap, Contact Plating: Gold, Length: 17.7mm, Width: 4.9mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-314-S003-55

GBP 2.73

1

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 30.5mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-624-S001-95

GBP 0.63

1

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Wire Wrap, Contact Plating: Gold, Length: 10.1mm, Width: 4.9mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-308-S003-55

GBP 1.67

1

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Wire Wrap, Contact Plating: Gold, Length: 20.3mm, Width: 4.9mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-316-S003-55

GBP 3.18

1

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 35.5mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-328-S001-95

GBP 1.28

1

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 50.8mm, Width: 4.45mm, Contact Material: Beryllium Copper, Housing Material: PBT, MPN: POS-640-S001-95

GBP 1.87

1

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 17.65mm, Width: 5.01mm, Depth: 10.16mm, Dimensions: 17.65 x 5.01 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOC-314-T051-99

GBP 0.23

1

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 20.19mm, Width: 5.01mm, Depth: 10.16mm, Dimensions: 20.19 x 5.01 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOC-316-T051-99

GBP 0.27

1

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 50.67mm, Width: 5.01mm, Depth: 17.7mm, Dimensions: 50.67 x 5.01 x 17.7mm, Contact Material: Beryllium Copper, MPN: LOC-640-S051-99

GBP 0.67

1

E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 22.8mm, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, MPN: POS-318-S001-95 X22

GBP 0.83

1

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 20.3mm, Depth: 2.8mm, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, MPN: POS-316-S001-95 X25

GBP 0.73

1

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 25.4mm, Width: 2.41mm, Depth: 10.16mm, Dimensions: 25.4 x 2.41 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOP-320-S083-95

GBP 1.68

1

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 30.48mm, Width: 2.41mm, Depth: 17.78mm, Dimensions: 30.48 x 2.41 x 17.78mm, Contact Material: Beryllium Copper, MPN: LOP-624-S083-95

GBP 2.04

1

E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 19.05mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 55.12mm, Depth: 1.7mm, Contact Material: Beryllium Copper, Housing Material: Polymer, Maximum Operating Temperature: +125°C, MPN: SDS-232-S075-95

GBP 14.20

1

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 17.78mm, Width: 2.41mm, Depth: 10.16mm, Dimensions: 17.78 x 2.41 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOP-314-S083-95

GBP 1.19

1

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 20.32mm, Width: 2.41mm, Depth: 10.16mm, Dimensions: 20.32 x 2.41 x 10.16mm, Contact Material: Beryllium Copper, MPN: LOP-316-S083-95

GBP 1.38

1

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 50.8mm, Width: 2.41mm, Depth: 17.78mm, Dimensions: 50.8 x 2.41 x 17.78mm, Contact Material: Beryllium Copper, MPN: LOP-640-S083-95

GBP 3.41

1

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, Minimum Operating Temperature: -55°C, MPN: POS-628-S035-55

GBP 4.53

1

E-TEC 2.54mm Pitch Vertical 32 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 32 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 40.6mm, Depth: 2.8mm, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, MPN: POS-632-S001-95 X12

GBP 1.40

1

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E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 6 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 20 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 24 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

E-TEC 2.54mm Pitch Vertical 14 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 40 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

E-TEC 2.54mm Pitch Vertical 32 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

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